Hexoloy® SiC ceramics provide mechanical, thermal and chemical stability as wafer carriers, oxidation furnace liners thermocouple protection tubes, and vacuum chucks.
A range of Hexoloy® SA and SG components can be used in semiconductor wafer processing equipment, including vacuum chucks, chemical mechanical polishing (CMP) blocks and wafer carrier trays.
These applications take advantage of Hexoloy silicon carbide's thermal expansion match to silicon, high elastic modulus, chemical inertness, and high thermal conductivity. Hexoloy silicon carbide is well suited as a structural material for low mass wafer carrier components, and rigid dimensionally stable platforms with exceptional flatness for wafer grinding, lapping, and polishing.
Silit® SK SiSiC and Advancer® NB SiC materials are used in the air-bearing stages of semiconductor metrology positioning equipment.
