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Semiconductor Wafer Processing
Silicon Carbide ComponentsHexoloy® SiC ceramics provide mechanical, thermal and chemical stability as wafer carriers, oxidation furnace liners thermocouple protection tubes, and vacuum chucks.
A range of Hexoloy® SA and SG components can be used in semiconductor wafer processing equipment, including vacuum chucks, chemical mechanical polishing (CMP) blocks and wafer carrier trays.
These applications take advantage of Hexoloy silicon carbide's thermal expansion match to silicon, high elastic modulus, chemical inertness, and high thermal conductivity. Hexoloy silicon carbide is well suited as a structural material for low mass wafer carrier components, and rigid dimensionally stable platforms with exceptional flatness for wafer grinding, lapping, and polishing.
Silit® SK SiSiC and Advancer® NB SiC materials are used in the air-bearing stages of semiconductor metrology positioning equipment.
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Features and Benefits
- Structural strength and thermal expansion close to that of silicon wafer
- Chemical corrosion resistance
- Thermal stability
- A range of electrical resistivity
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Sintered Silicon Carbide Materials For Semiconductor Processing
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Key Products
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FAQ
Hexoloy® sintered silicon carbide can be used in a wide range of components, including:
- Vacuum chucks
- Reactor tubes for thermal oxidation
- Wafer grinding and polishing plates
- Thermocouple protection tubes
- Wafer carrier trays
- Clamps and lift pins
- Sputtering targets
Silit® SiSiC and Advancer® NB SiC products are used in the construction of air-bearing stages for positioning equipment.
Hexoloy® sintered silicon carbide is essentially a single-phase material with at least 98% SiC.
At this purity, Hexoloy® can be successfully used at low to moderate temperatures in wafer contact applications, and up to 1,300°C in non-contact applications.
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